Semiconductor Outsourcing Solutions (SOS) bring years of global experience to the front and backend. We help our clients develop, implement, ramp, and monitor various packaging technologies that enables their company to grow.  Leveraging our ability to successfully apply highly evolved technology to package design, materials selection, process design, manufacturing and testing we focus are capabilities in industries related to MEMS, Memory, and Semiconductors.

Semiconductor Outsourcing Solutions areas of specialization include but not limited to:

• Packaging Designs
• Technology and Process Development
• Package Reliability
• Test
• Operations Ramp & Monitor
• Global Supply Chain Reach
• Business Development & Marketing

Project Examples

• Improved backend MEMS processes
• Implemented systems and packages for various MEMS and fabless companies
• Particle reduction processes for MEMS devices
• Ramped several product types for various fabless companies
• Assisted in the implementation of Flip Chip, Power, Stack and CSP type packages
• Reduction of cycle time and cost saving processes
• Supply chain selection & package development
• Market analyses for various semiconductor material companies
• Due diligence for multiple companies involved in the maufacturing of substrates, and backend materials (gold wire, solderballs, die attach, thermal materials, liquid and mold compounds, etc.)
• Develop and implement unique process equipment for MEMS assembly
• And much much more..........